Round D170 D200 Electroplated Diamond Grinding Wheel

Electroplated diamond grinding wheel

Introduction :

For diamond grinding wheels, the working layer of the grinding wheel contains diamond abrasive grains, and the diamond abrasives are bonded to the substrate by a metal bond. First, the thickness of the metal bond deposited is 20% of the height of the diamond abrasive grains (sanding), and then the metal bond is used to bond (thicken) the diamond abrasive grains, and the thickness is about 2/3 of the height of the abrasive grains. Including diamond dressing wheels, diamond wheels for grinding or cutting.

Advantage:

1. It is easy to use without trimming;

2. The single-layer structure determines that it can achieve a high working speed, which is currently as high as 250-300m/s ;

3. Although there is only a single-layer diamond, it still has sufficient life;

4. High precision requirements for roller grinding wheels, electroplating manufacturing methods.
Because of these advantages, high-speed and ultra-high-speed grinding of electroplated grinding wheels occupies an undisputed leading position.

D200 Electroplated Diamond Grinding Wheel

D170 Electroplated Diamond Grinding Wheel

D200 electroplated grinding wheels

Round D170 D200 Electroplated Diamond Grinding Wheel Images